Materijali u elektrotehnici, vezani  za lemljenje. Materijali koji se upotrebljavaju u lemljenju, karakteristike tih materijala. općenito sve vezano uz lemljenje, slike spojeva...

Knjige:

1. Lemljenje // Tehnički leksikon : A-Ž. Zagreb : Leksikografski zavod Miroslav Krleža, 2007 - sign. 62(03) /TEH/
2. Zavarivanje i srodni postupci : Lemljenje // Tehnička enciklopedija. Zagreb : Jugoslavenski leksikografski zavod, 1963.-1997 - Sv. 13 : Ter-Ž
3. Kapov, Milutin: Elektrotehnički materijali i tehnologije : interna skripta. Split : Fakultet elektrotehnike, strojarstva i brodogradnje, 2005 - sign. 621.31(075.8) /KAP/ e
4. Osmokrović, Predrag: Elektrotehnički materijali. Beograd : Akademska misao, 2003 - sign. 621.31(075.8) /OSM/ e
5. Gojić, Mirko: Tehnike spajanja i razdvajanja materijala. Sisak : Metalurški fakultet, 2008 - sign. 621.7(075.8) /GOJ/ t OP
6. Proizvodno strojarstvo / [uredništvo sveska Andrija Mulc...[et al.]. Zagreb : Školska knjiga, 1998- . - Sv. 1 : Materijali / [autori Franjo Kovačiček... [et al.] - sign. 62(03)sv1 /PRO/   OP

EBSCO Host (pristup u GISKO ili putem CARNet Centra za online baze - Proxy):

1. Stromswold, E. I.; Pratt, R. E.; Quesnel, D. J.: Capillary soldering system for the material property characterization of solder joints. // Review of Scientific Instruments. Nov93, Vol. 64 Issue 11, p3314
2. Xiaopeng Li; Fan Gao; Zhiyong Gu: Nanowire Joining Methods. // Open Surface Science Journal. 2011, Vol. 3, p91-104
3. Hwang, Jennie S.: STEP 3: Solder Materials. // SMT: Surface Mount Technology. Mar2004, Vol. 18 Issue 3, p52-56

ScienceDirect (pristup u GISKO ili putem CARNet Centra za online baze - Proxy):

1. A.A. Wronkowska, G. Czerniak, A. Wronkowski, Ł. Skowroński: Optical and microstructural characterisation of Au-Sn and Cu-Sn diffusive layers // Applied Surface Science, In Press, Accepted Manuscript, Available online 25 January 2013
2. Qin Lu, Zhuo Chen, Wenjing Zhang, Anmin Hu, Ming Li: Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones // Applied Surface Science, In Press, Corrected Proof, Available online 26 December 2012

WoS (pristup u GISKO ili putem CARNet Centra za online baze - Proxy):

1. X. Cheng, C. Liu, V.V. Silberschmidt: Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures // Computational Materials Science, Volume 52, Issue 1, February 2012, Pages 274-281

Google Books:

1. Deborah D L Chung: Materials for electronic packaging. Boston : Butterworth-Heinemann, ©1995.
2. Daniel Lu; C P Wong: Materials for Advanced Packaging. Boston, MA : Springer US, 2009.